Handbook of Semiconductor Manufacturing Technology

Introduction to Semiconductor Devices 1(1) John R. Hauser Introduction 1(2) Overview of MOS Device Characteristics 3(5) MOSFET Device Scaling 8(14) Scaling Rules Performance of Scaled Devices Manufacturing Issues and Challenges 22(22) MOSFET Gate Stack Issues Channel Doping Issues Source/Drain Contact Issues Substrate and Isolation Issues Thermal Budget Issues Advanced MOS Device Concepts 44(9) SOI Substrates and Devices Multiple Gate MOS Devices Transport Enhanced MOS Devices MOSFETS with Other Semiconductors Advanced Semiconductor Device Concepts Conclusions 53(1) References 53(1) Overview of Interconnect---Copper and Low-K Integration 1(1) Girish A. Dixit Robert H. Havemann Introduction 1(5) Dual Damascene Copper Integration 6(10) Copper/Low-k Reliability 16(3) Conclusion 19(1) References 20 Silicon Materials 1(1) Wen Lin Howard Huff Introduction 1(1) Silicon Crystal Growth Processes 2(3) Float Zone Silicon Growth Czochralski Silicon Growth Characteristics of Czochralski Silicon Growth 5(33) Thermal Characteristics for Dislocation-Free Growth Impurity Incorporation Grown-In Microdefects Trends in Large Diameter Silicon Growth 38(7) Evolution in Crystal Diameter Continuous Czochralski Silicon Growth Wafer Preparation 45(4) Slicing Chemical Etching Edge Rounding Lapping/Grinding Polishing Cleaning Epitaxial Growth 49(12) Silicon Epitaxial Wafer Heteroepitaxy Selective Epitaxial Growth Strained Silicon Epitaxy Oxygen Behavior in Silicon Processing 61(7) Oxygen Precipitation Kinetics Oxygen Precipitation in p+ and n+ Effects of Oxygen Precipitation on Device Processing Denuded Zone and Oxygen Precipitation by Controlled Vacancy Concentration Other and New Applications of Silicon Materials 68(2) Nitrogen Doping and Its Effects on CZ Silicon High Resistivity Silicon Summary 70(1) References 71 SOI Materials and Devices 1(1) Sorin Cristoloveanu George K. Celler Introduction 2(1) SOI Basics: A Tutorial 3(3) What It Is: A Definition How It Is Made: A Very Brief Description How SOI Devices Work SOI Wafer Fabrication Methods-Some Details 6(12) Wafer Bonding Smart Cut™ Technology Bond and Etchback ELTRAN SIMOX Other Fabrication Methods Advanced Wafer Engineering 18(6) Crystal Orientations Strained Silicon-on-Insulator Ge-on-Insulator and Other on-Insulator Substrates Physical Characterization of SOI Wafers 24(2) Si and BOX Thickness Measurements Surface Roughness Structural Defects Stress (Strain) Measurements by Raman Spectroscopy Inspection for Particles and Other Defects Electrical Characterization 26(2) Wafer Characterization: Ψ-MOSFET Device Characterization Partially-Depleted SOI MOSFETs 28(1) Kink Effect Hysteresis and Latch Parasitic Bipolar Transistor (PBT) Transient and History Effects Fully Depleted SOI MOSFETs 29(4) Threshold Voltage Subthreshold Slope Transconductance Meta-Stable Dip Volume Inversion Transition from Partial to Full Depletion Scaling Trends 33(7) Short Channels Narrow Channels