Handbook of Materials Failure Analysis

<p>Part 1: Electronics Industries<br>1. Failures of Electronic Devices: Solder Joints Failure Modes, Causes and Detection Method<br>2. Electron-beam Radiation Damage and the Technical Solutions for Materials Failure Analysis of Electron-beam Sensitive Materials in Modern Semiconductor Industry<br>3. Failure of intermetallic solder ball due to stress shielding and amplification effects<br>4. Assessment of the indoor corrosion in consumer electronics in subtropical climates.<br>5. Pb-free Solder – Microstructural, Material Reliability and Failure Relationships<br>6. The Role of Contamination in Failures of Electronics – Case Studies<br>7. Reliability analysis of vibrating electronic assemblies using analytical solutions and response surface methodology<br>8. Stress Analysis of Stretchable Conductive Polymer for Electronics Circuit Application<br>9. New methodology for qualification and lifetime assessment of electronic systems</p> <p>Part 2: Textiles Industries<br>10. Textile Failure Analysis and Mechanical Behavior Characterization by using Acoustic Emission Technique<br>11. Failure of yarns in different textile applications<br>12. Treatment effect on failure mode of industrial carbon textile at elevated temperature</p>