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Mechanics of Solder Alloy Interconnects

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Gebonden, 418 blz. | Engels
Springer US | 1994e druk, 1994
ISBN13: 9780442015053
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Springer US 1994e druk, 1994 9780442015053
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Samenvatting

The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.

Specificaties

ISBN13:9780442015053
Taal:Engels
Bindwijze:gebonden
Aantal pagina's:418
Uitgever:Springer US
Druk:1994

Inhoudsopgave

Foreword; Acknowldgement; Introduction: the mechanics of soldere alloy interconnect; Microstructural influences on the mechanical properties of solder; Interfaces and intermetallics; Constitutivemodels; Prediction of solder joint geometry; Life prediction and accelerated testing; Thermomechanical modeling of solder joints - numerical considerations; Applications - through-hole; Surface mount solder joints under thermal, mechanical, and vibration conditions; Index

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        Mechanics of Solder Alloy Interconnects