Thin-Film Capacitors for Packaged Electronics

1 Introduction.- 1.1 Capacitor Fundamentals.- 1.2 Application Domains.- 1.3 Physical Structures/Embodiments.- 1.4 Capacitor Integration Drivers.- 1.5 Thin-Film Capacitor Technology.- 1.6 Summary.- 1.7 References.- 2 Design Fundamentals.- 2.1 Breakdown Voltage and Capacitance Density Design Limits.- 2.2 Tolerance in Capacitance Density.- 2.3 DC Leakage.- 2.4 Capacitor Losses.- 2.5 Series Inductance and Resistance.- 2.6 References.- 3 Performance Detractors.- 3.1 Interfacial Micro-roughness.- 3.2 Deviation from Optimal Stoichiometry.- 3.3 Film Microstructure.- 3.4 References.- 4 Electrical Characterization.- 4.1 Thin Film Decoupling Capacitors.- 4.2 Characterization Methodologies.- 4.3 Test Vehicle: Design and Fabrication.- 4.4 Dielectric Constant and Loss.- 4.5 Total Series Inductance.- 4.6 Leakage Current Density.- 4.7 Capacitance Density and Breakdown Field.- 4.8 Summary and Conclusion.- 4.9 References.- 5 Integration Issues and Challenges.- 5.1 Metal Diffusion into Dielectrics.- 5.2 Interlayer Stresses and Adhesion.- 5.3 Low Thermal Budget.- 5.4 References.- 6 Applications.- 6.1 2D Interconnections in ICs.- 6.2 Integration into 2D Packaging.- 6.3 Flex Circuits.- 6.4 Large Area Power Distribution.- 6.5 Integration into 3D Structures.- 6.6 Electromagnetic Considerations.- 6.7 Power Electronics.- 6.8 References.