RF and Microwave Microelectronics Packaging II

Chapter1.&nbsp;Introduction to RF and Microwave Microelectronic Packaging.- Chapter2.&nbsp;Packaging of Transmit/Receive Modules.- Chapter3.&nbsp;3D Transitions and Connections.- Chapter4.&nbsp;Electromagnetic Shielding for RF & Microwave Packages.- Chapter5.&nbsp;Design of C-Band Interdigital Filter and Compact C-band Hairpin Bandpass Film Filter on Thin Film Substrate.- Chapter6.&nbsp;Research on High-reliable Low-loss HTCC Technology Applied in Millimeter Wave SMT Package.- Chapter7.&nbsp;Chip Size Packaging (CSP) for RF MEMS Devices.- Chapter8.&nbsp;The challenge in packaging and assembly the advanced power amplifiers.- Chapter9.&nbsp;High Thermal Conductivity Materials – Aluminum Diamond, Aluminum Silicon Carbide, and Copper Diamond.- Chapter10.&nbsp;Advancement in High Thermal Conductive Graphite for Microelectronic Packaging.- Chapter11.&nbsp;Carbon nanotubes and graphene for microwave/RF electronics packaging.<p></p><p></p><p></p><p></p><p></p>