Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces

Name: Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
Author: Qingke Zhang

Specificaties

Gebonden, blz. | Engels

Springer Berlin Heidelberg | e druk, 2015

ISBN13: 9783662488218

Rubricering

Juridisch :

Springer Berlin Heidelberg e druk, 2015 9783662488218

Onderdeel van serie Springer Theses

€ 60,99

In winkelwagen

Levertijd ongeveer 9 werkdagen

Gratis verzonden

Samenvatting

This thesis
presents a series of mechanical test methods and comprehensively investigates
the deformation and damage behavior of Cu/Pb-free solder joints under different
loading conditions. The fracture behavior of Pb-free joint interfaces induced
by stress, deformation of solder and substrate are shown, the shear fracture
strength of the Cu6Sn5 IMC is measured experimentally for the first time, and
the dynamic damage process and microstructure evolution behavior of Pb-free
solder joints are revealed intuitively. The thesis puts forward the argument
that the local cumulative damage is the major cause of failure in solder
joints. The research results provide the experimental and theoretical basis for
improving the reliability of solder joints.

Specificaties

ISBN13:9783662488218

Taal:Engels

Bindwijze:gebonden

Uitgever:Springer Berlin Heidelberg

Serie:Springer Theses

Inhoudsopgave

Research Progress in Pb-free Soldering.- Fracture Behavior of IMCs at Cu/Pb-free Solder Interface.- Tensile-compress Fatigue Behavior of Solder Joints.- Shear Creep-fatigue Behavior of Cu/Pb-free Solder Joints.- Thermal Fatigue Behavior of Sn-Ag/Cu Solder Joints.- Conclusions.<br>

Uw winkelwagen

Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces

Samenvatting

Specificaties

Inhoudsopgave

Net verschenen

Rubrieken

Personen

Trefwoorden