Advances in Materials Science and Implant Orthopedic Surgery

Preface. Introduction: Biomaterials and Implant Surgery; J. E. Lemons. Particles of Biomaterials Recruit Macrophages which can Differentiate into Bone Resorbing Cells; R. Pandet et al. Biological Consequences of Polymeric Materials - Silicones, PMMA, UHMWPE; N. Kossovsky. The Characterization of Biologically Important Apatite Surfaces Using the Dual Composition and FTIR Microsocopy Techniques; E. P. Paschalis et al. Activity of Plasma Proteins Regarding Biomaterials Corrosion - pH Effects; H. Thomás et al. Zespol Stabilizer in the Treatment of Open Fractures of the Zeugopodium Bones in Dogs and Cats; Z. Klos et al. R&D and Manufacturing of Biomaterials and Implants in the Socio-Political Context; C. A. Homsy. Materials and Reliability Issues in Total Hip Arthroplasty; E. M. Lenoe. Mechanical Failure of Cemented Femoral Total Hip Replacement; N. Verdonschot, R. Huiskes. Modelling and Finite Element Analysis of a Ceramic Femoral Knee Prosthesis; W. M. Payten et al. The Influence of Processing Conditions on the Mechanical Behaviour of UHMWPE/HA and PMMA/HA Composites; A. M. Cunha et al. Behaviour of HA Coated Ti-6A1-4V under Cyclic Bending in Hank's and Isotonic Saline Solutions: An Electrochemical and Structural Study; R. L. Reis, F. J. Monteiro. Improvement of Ion Implantation of Prosthetic Femoral Heads. Testing of the Friction Behaviour with a Physiological Hip Joint Simulator; F. Bernard et al. Wear Behaviour of Ion Implanted TI6AL4V Against UHMWPE; H. Schmidt et al. Biological Resurfacing Using Synthetic Materials: A Review of Surgical Philosophy and Clinical Experience Using a Carbon Fibre; R. J. Minns. Processing Biodegradable Natural Polyesters for Porous Soft Materials; C. Chaput et al. The Role of Acrylic Polyelectrolytes and Acrylic Gels as CrystallizationInhibitors and Promotors of Calcium Oxalate; M. Oner, P. Calvert. Sol-Gel Derived Bioactive Hydroxyapatite Coatings; B. Ben-Nissan, C. Chai. Brazing of Al2O3 to AISI 316L Stainless Steel and Ti c.p. for Packaging Telemetric Systems for Orthopaedic Applications; O. C. Paiva, M. A. Barbosa. Summary Discussion. Index.