Electrical Design of Through Silicon Via

Name: Electrical Design of Through Silicon Via
Author: Manho Lee

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Paperback, blz. | Engels

Springer Netherlands | e druk, 2016

ISBN13: 9789401779494

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Springer Netherlands e druk, 2016 9789401779494

120,99

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Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.

Specificaties

ISBN13:9789401779494

Taal:Engels

Bindwijze:paperback

Uitgever:Springer Netherlands

Inhoudsopgave

<p>Preface.- 1 Introduction.- 2 Electrical Modeling of a Through-Silicon Via (TSV).- 3 High-speed TSV-based Channel Modeling and Design.- 4 Noise Coupling and Shielding in 3D ICs.- 5 Thermal Effects on TSV Signal Integrity.- 6 Power Distribution Network (PDN) Modeling and Analysis for TSV and Interposer-based 3D-ICs in the Frequency Domain.- 7 TSV Decoupling Schemes.- Index.</p>

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