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Electronic Packaging Materials Science X: Volume 515

Specificaties
Gebonden, 262 blz. | Engels
Materials Research Society | e druk, 1998
ISBN13: 9781558994218
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Materials Research Society e druk, 1998 9781558994218
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Samenvatting

Advanced packaging applications are demanding increasingly more innovative materials sets in order to ensure overall package reliability. In addition, as we migrate towards higher-density inter-connects, the assembly operation will require new processes and process materials to guarantee both performance and manufacturability. This book explores the questions of materials, processes and reliability for high-density package solutions. The book is strengthened by invited and contributed papers from a host of national and international experts. Topics include: interfacial adhesion behavior; flip-chip interconnections; high-density substrates; thermomechanical behavior and packaging reliability issues.

Specificaties

ISBN13:9781558994218
Taal:Engels
Bindwijze:Gebonden
Aantal pagina's:262
Uitgever:Materials Research Society

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€ 32,70
Levertijd ongeveer 9 werkdagen
Gratis verzonden

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        Electronic Packaging Materials Science X: Volume 515